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Western Digital begins production of the world's tallest 3D NAND 'skyscraper'

Western Digital today announced that it has kicked off production of the industry’s densest 3D NAND flash chips, which stack 64 layers atop another and enable three bits of data to be stored in each cell. The 3D NAND flash chips are based on a vertical stacking or 3D technology that Western Digital and partner Toshiba call BiCS (Bit Cost Scaling). WD has launched its pilot production of its...
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