Huawei and Intel have signed a memorandum of understanding (MOU) to cooperate on high performance computing products and technology innovation. The MOU was made public at Hannover Messe, a conference that focuses on advanced industrial technology. According to the announcement, the collaboration will center around the development of Huawei servers and cloud computing hardware based on Intel’s Xeon and Xeon Phi processors, as well as its Omni-Path interconnect. Huawei will also build three HPC innovation centers infused with Intel technology, two in China (Shenzhen and Chengdu) and one in Germany (Munich). The centers will be used to engage in joint initiatives like application optimization, technical training and community development. In addition, the two companies will collaborate on joint marketing activities. Learn more at https://www.top500.org/news/huawei-and-intel-sign-up-for-hpc-collaboration/
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